For a long time, chip has been one of the important fields of "controlled by others" in China's development. However, now, "China core" has risen strongly. Pingtouge, a semiconductor company under Alibaba, released its self-developed cloud chip Yitian 710. The chip is the most powerful arm server chip in the industry, with performance exceeding the industry benchmark by 20% and energy efficiency ratio increased by more than 50%. Yitian 710 is an important step for Alibaba cloud to promote the "one cloud multi-core" strategy. It is also Alibaba's first CPU chip born for the cloud. Applications will be deployed in Alibaba cloud's data center.
What are the considerations for Ali's launch of infrastructure level products for its own use? The answer is to update the computing architecture. A new computing architecture with cloud as the core is taking shape. With the further integration of cloud and network technologies, computing will further migrate to the cloud in the future, whether enterprises or individuals. This new system is evolving at three levels: first, at the infrastructure level, the cloud defines hardware, develops underlying technologies such as chips, servers and operating systems, and builds a hardware system with cloud as the core; Secondly, the core software is reconstructed based on the cloud, the open source community becomes the innovation center, and gives birth to new development methods such as low code, making the cloud easier to use; Finally, at the application layer, in the future, with the development of 5g network, computing and data will accelerate the migration to the cloud, giving birth to new species such as cloud computer, metauniverse and automatic driving.
In addition, the conference also exhibited cutting-edge technologies such as carbon based chips, biochips and micro current chips. Carbon based chip is a semiconductor technology developed on carbon nanotubes, graphene and other materials, which is regarded as the direction of the next generation chip. In the same process, comparable silicon-based chips have higher performance and lower power consumption. The performance of carbon-based chips with 90 nm process is expected to be equal to that of silicon-based chips with 28 nm process. It is worth mentioning that the development of chip ecology in China is also actively promoted. For example, at the conference, Ali pingtouge announced that the full range of risc-v processors of xuantie were open source, which further narrowed the distance between risc-v technology and developers and became a new milestone of global hardware open source.
In 2018, the game world in Spielberg's film virtual world was the perfect presentation of modern artists' imagination of the meta universe, which also shaped the first cognition of the concept of the meta universe by most people.
Metauniverse is an all inclusive virtual world approaching the real world infinitely. Combined with AR, VR, 5g, cloud computing, AI and other technologies, it is setting off a new wave in the field of science and technology. In the exhibition area, visitors are guided by digital people through the meta universe tunnel, starting from understanding the concept, gradually understanding the application scene and imagining the trend, and then experiencing the changes brought by the meta universe for the first time through VR games, holographic images and other technologies.
The concept of "meta universe" originated from the novel avalanche written by American science fiction writer Neil Stephenson. In the virtual world parallel to the real world created by hackers, everyone has his own avatar, just like a Sims, to meet and communicate with his friends. In reality, with the development and maturity of artificial intelligence, virtual reality (VR), augmented reality (AR), extended reality (XR), 5g communication and the Internet of things, the digital virtual world will be deeply integrated with the real world, bring people the reconstruction of perception from "online" to "present", and give birth to updated consumption patterns and updated business formats.
In the field of bionics, yunqi conference also showed the charm of science and technology. Bionic fish appeared at the cloud habitat conference, which made people mistakenly think they were in the aquarium. The as like as two peas, the real dragon is actually the same as the real dragon fish. According to the staff, this self-developed multi joint arowana imitation robot product is designed according to the swimming posture and appearance style of arowana and relying on the existing fluid simulation technology. It can swim smoothly and gracefully like a real fish, turn and avoid obstacles, so as to achieve the effect of false chaos and truth.
In addition to the golden dragon fish and building block fish, other kinds of bionic fish are also displayed in the venue: sharks, carp, etc. the appearance and action of these bionic fish are not much different from ordinary fish.

Cloud computer, flying car, metauniverse, bionic fish, exoskeleton manipulator, quadruped robot... At the 40000 square meter science and technology exhibition, more than 1500 interesting or novel scientific and technological achievements were unveiled, which can be called a digital science and technology feast. At the yunqi conference, we saw the prototype of the future world.
As one of the most scientific and technological events in China and the largest in the world, "Hangzhou yunqi conference" has set up hundreds of science and technology forums with the theme of "frontier, exploration and imagination" this year, and nearly 1000 leading figures from academia and industry share their feelings to talk about the trend and insight of frontier and hard core technology. Exhibitors include more than 200 universities, scientific research institutions and science and technology enterprises such as Tsinghua University, Peking University, the Fifth Academy of Astronautics, the National Astronomical Observatory, Xiaomi and BOE. It is really a gathering of stars and an explosion of sense of science and technology.
AI + science, metauniverse, bionic robot... The cloud habitat conference will take you to see the future
Open source idea stimulates AI + science to be more innovative
In 2021, AI and science are two hot words. Alphafold2 makes a breakthrough in predicting protein structure with deep learning technology. This computing work shows the great potential of AI to solve problems in the field of science. Extending from the single scene of biology, AI represented by deep learning is combined with scientific computing to form a new computing method in many fields such as physics, chemistry, materials and geology.
"Ai + science" will bring systematic opportunities. AI represented by machine learning has the ability of complex data processing, which can make the trained physical model have both micro scale accuracy and macro scale efficiency. It can not only effectively solve the difficult and long scientific calculation process, but also systematically solve the problems of drug design Micro design problems in the fields of material design and chemical design to realize "fast and accurate" calculation and simulation.
From the engineering of scale, data and performance, for AI + science, "scale engineering" will be more oriented to computing itself; "Data engineering" will need to be physics oriented and respect physical constraints; "Performance engineering" will no longer be the adaptation of software to hardware, but the customization of hardware to algorithm.
Such engineering requires the joint efforts of scientists, engineers and all walks of life. Therefore, open source decentralized collaborative development and rapid implementation of distributed review on the basis of development is a verified and best software collaborative development model, which also creates a new idea of "Ai + science" new generation infrastructure - "open source collaboration".
The open source model has brought rapid development to the computer field in the past half century, but it is still a new thing in the field of scientific computing. However, this efficient cooperation model based on the spirit of open sharing and peer evaluation mechanism has developed very rapidly. Nowadays, with the deepening of open source thinking, a new generation of AI + science system is being established: the underlying computing power scheduling, various scale physical engines, databases and workflow for various computing needs are all rapidly iterating. Based on open source software, thousands of research groups in materials, chemistry, biology and other fields from all over the world are broadening their scientific research boundaries and producing many high-quality scientific research achievements.

As a technology driven hard technology industry, semiconductor industry has been inseparable from capital from the beginning. It was with Arthur rock's venture capital that Fairchild Semiconductor, the world's first semiconductor franchise company, was established, and Santa Clara Valley finally became Silicon Valley. With the continuous maturity of the industry, M & A, splitting and reorganization appear more and more in the semiconductor industry, so the importance of capital to the development of the semiconductor industry is becoming more and more prominent.
In China, in the past ten years, the semiconductor industry was in the ice age in the first five years, and few people paid attention to it. However, during this period, starting from the outline for promoting the development of the national integrated circuit industry published by the State Council in 2014 and marked by the establishment of the national integrated circuit industry fund, some olfactory industrial capital began to focus on hard science and technology; With the Sino US scientific and technological war as the tipping point, more and more funds have found the historic opportunity of China's semiconductor industry and began to flock in. Today, no one in the capital circle has not invested in semiconductors.
For China's semiconductor industry, the influx of capital is not a bad thing. For such an industry with very high requirements for capital, talents and fixed investment (Manufacturing), a main factor limiting China's industrial development before 2014 is insufficient investment. But the bubble brought by the capital Carnival approach also has many negative effects.
So, what kind of industrial capital does China Semiconductor need? How should industrial capital play a positive role and avoid negative effects in the historical critical period of the development of China's semiconductor industry?
He Hui, chief analyst of omdia semiconductor, a market research institution, said that industrial capital should have the ability to build a platform and integrate resources. At present, there are more than thousands of integrated circuit enterprises in China. How to help semiconductor enterprises integrate and build large and strong leading enterprises is the number one task of current industrial capital.
In terms of integrating semiconductor industry resources, CCG assets and Zhilu capital under Rongxin industry alliance have very successful cases.
In 2017, CCG assets wholly acquired Nexperia, which was spun off from NXP, which became the semiconductor case with the largest amount of international mergers and acquisitions (US $2.75 billion) by China's industrial capital in recent years and the most successful case. Before the split, as the standard product department of NXP, the growth rate was only hovering in single digits due to mature products and low company investment. After the acquisition of Jianguang assets, the three-year revenue increased by 50% to US $1.6 billion. After that, CCG assets sold ANSYS semiconductor to Wentai technology, which has been transformed into China's largest IDM (vertically integrated device) semiconductor company with a market value of more than 100 billion.
In fact, as early as 2015, CCG assets spun off the power semiconductor department from NXP and established Ruineng semiconductor in a joint venture with NXP. Now its revenue has doubled compared with that when it established the joint venture, and will be ready to be listed in the domestic securities market in the near future, which not only greatly improved the business situation, brought success to employees and customers, but also gave very good returns to investors.
It is noteworthy that although the difficulty of international M & A of Chinese capital has increased significantly in the past two or three years, Zhilu capital has sprung up and created a number of successful acquisition cases. In July 2020, Zhilu capital wholly acquired UTAC, the world's third largest automotive electronic packaging and testing enterprise. After more than a year of transformation, UTAC has greatly improved its revenue and net profit. Zhilu capital hopes to build UTAC into a semiconductor packaging and testing enterprise with the top five global revenue and the first profit in China by loading high-quality assets and connecting domestic resources.

October 26, 2021, Shenzhen, Guangdong - on October 24, ASML, an innovative leader in the semiconductor industry, held an industry sharing meeting for software engineers for the first time. With the theme of "1024 computing · core future youth theory", Tang Buzhou, an associate professor of Shenzhen Graduate School of Harbin University of technology, ASML technical experts and career development consultants were invited to join the majority of software engineers and young students of science and engineering, Explore the development prospect and talent demand in the semiconductor field, and strive to encourage and attract more excellent software talents to join the semiconductor industry and help the cultivation of talents in the industry.
In recent years, driven by new applications such as 5g, cloud computing, Internet of things, artificial intelligence and intelligent networked vehicles, China's integrated circuit market has continued to grow, and the average salary in the semiconductor industry has also increased year by year. From the second quarter of 2019 to the first quarter of 2020, the average salary of R & D Posts reached 20601 yuan / month before tax. On the contrary, the phenomenon of talent shortage is obvious. According to the data of the white paper on talents in China's integrated circuit industry (2019-2020), there is a semiconductor talent gap of about 300000 in China.
Good employment prospects are attracting young engineers and fresh graduates to join the semiconductor industry. Tang Buzhou pointed out: "The lack of core has attracted much attention in the semiconductor industry. As the cornerstone of driving new application scenarios such as 5g and the Internet of things, the importance and development prospect of chips are self-evident. Now choosing semiconductors as the direction of career choice can be said to catch up with the trend of the times. China is vigorously developing the semiconductor industry. Major companies have successively launched the 'core making' plan and continuously increased chip research and development But many people may not know that the semiconductor industry is not only open to hardware talents, but also needs "full stack talents" with both software and hardware capabilities. "
Semiconductor development gives birth to the demand for compound software talents
The semiconductor industry is a highly globalized industrial chain. Lithography equipment is a crucial link in chip production, which requires a lot of hardware production and talent investment. However, with the development of Moore's law, the ultimate pursuit of precision has brought great challenges to the production yield and efficiency of the new generation of chip technology, and the importance of software talents in the semiconductor industry has gradually become prominent.
As a global leader in chip lithography technology, ASML has deeply cultivated technological innovation and talent accumulation, innovatively launched pioneering technologies such as immersion lithography and double wafer platform, promoted the steady development of the semiconductor industry, and established its leading position in the lithography field. Integrating lithography imaging, computational lithography technology and measurement and inspection technology, ASML has innovatively put forward a comprehensive lithography solution Solution, and optimize the process window to achieve smaller device size according to the requirements of mass production. Among them, ASML Brion is responsible for computational lithography Business is to use computer software to simulate and simulate the lithography process in advance, correct the mask and light source, and improve the yield and production efficiency. ASML lithography machine is a complex of high-tech hardware and advanced software.
Shao Debao, technical expert of ASML Brion, said at the sharing meeting: "The modeling process in computational lithography involves physics, chemistry, optics, image processing and other technologies. In the mask and light source correction stage, it also involves computer graphics and mathematical knowledge. The whole process requires very careful precision calculation and control, which is no less than that of Shenzhou 13 launch. Most of our software engineers are compound talents with excellent software and hardware Have solid interdisciplinary knowledge. For talents who are interested in semiconductor software, they will have a stronger career threshold and competitiveness in the future. "

Nowadays, as the semiconductor process technology becomes more and more advanced, the requirements for the mechanical equipment for manufacturing chips are also higher and higher. Therefore, the EUV lithography machine produced by ASML company in the Netherlands has become the key production equipment of semiconductor process technology. However, due to the high cost of EUV lithography machine, the price of each machine exceeds US $100 million, the difficulty of manufacturing EUV lithography machine and the serious shortage of production capacity, major chip production companies are crazy to grab EUV lithography machine, and if there is a lack of lithography machine, the production cost of chip will be greatly increased.
In the face of such severe problems, kioxia, a large Japanese storage company, and canon, a semiconductor equipment factory, and DNP, a semiconductor component manufacturer such as a mask, have jointly developed a new nil process technology, which can advance the semiconductor process technology to 5nm without EUV lithography.
It is reported that Kaixia has mastered the mass production technology of 15nm process. At present, it is making every effort to develop the technology below 15nm. It is expected to further achieve the planned goal in 2025.
Compared with the commercial EUV lithography technology, Kaixia said that the advantage of nil technology is that it can greatly reduce energy consumption and reduce equipment cost. The reason is that the lithography process of nil technology is relatively simple, the power consumption can be reduced to 10% of EUV technology, and the equipment investment can be reduced to only 40% of EUV equipment. At present, only ASML in the Netherlands can produce and supply the high-end EUV lithography machine. It not only has high price, but also needs the cooperation of many testing equipment, and the production is extremely difficult and the production capacity is extremely limited.
However, although nil technology has many advantages, there are still many problems to be solved in mass production at this stage. The big problem is that compared with EUV lithography machine, nil technology is more likely to form defects due to the influence of fine dust in the air.
It is reported that for Kaixia, NAND components are easier to adapt to the nil technology process because they adopt a 3D three-dimensional stacking structure. Kaixia also said that at present, it has successfully solved the basic technical problems of nil and is promoting mass production technology. It is hoped that it can be introduced into NAND production first than other competitors. Once Kaixia successfully takes the lead in introducing nil technology and realizing mass production, it is expected to make up for the adverse situation in the equipment investment competition and meet the needs of reducing carbon emissions.
In addition, according to DNP, the circuit miniaturization degree of nil mass production technology can reach 5nm nodes, and DNP has been conducting internal simulation according to the specification value of the equipment since the spring of 2021. For such technological progress, DNP revealed that many semiconductor manufacturers have begun to ask about nil mass production technology, which means that many manufacturers have high hopes for nil technology.
Canon, another partner, is also committed to widely applying nil mass production technology to the equipment for making logic chips such as CPU for DRAM and PC, so as to supply more semiconductor manufacturers in the future, and hope to be applied to the most advanced processes such as mobile phone application processor in the future.
If nil can be successfully developed in the future, it is definitely good news for the current semiconductor industry. Therefore, the production capacity of semiconductor chips will be greatly improved, which can also greatly alleviate the global core shortage problem.

Industry development prospect and trend forecast
1. Cost efficiency promotes the development of semiconductor silicon wafer in the direction of large size, and the application field of products continues to expand
As the main basic material in the manufacturing process of semiconductor devices, semiconductor silicon wafer plays a leading role in semiconductor materials. Because large-size silicon wafer can reduce the production cost per chip, it is expected that semiconductor silicon wafer will develop towards large-size (12 inches). Due to the high purity of 12 inch silicon wafer, it is difficult to develop technology and large-scale production. It is expected that in the process of the gradual transfer of the semiconductor industry to China, the technology gap at home and abroad will gradually narrow in the field of semiconductor key materials. At the same time, the production of 12 inch semiconductor silicon wafer will also broaden the downstream, so as to expand the application field of semiconductor silicon wafer from consumer electronics to logic chip High end semiconductor manufacturing fields such as memory chips.
2. Downstream demand drives the growth of semiconductor wafer market scale. It is estimated that the market scale of semiconductor wafer industry will reach about US $4.3 billion by the end of 2026
At present, many domestic manufacturers have begun to expand the production capacity of 12 inch and 8-inch monocrystalline silicon chips, and the planned production capacity of major manufacturers has been put into operation. As the world's largest terminal market of semiconductor products, China is expected to continue to expand the production capacity of semiconductor downstream chip manufacturing and the demand of semiconductor industry in the future, It is expected that the scale of China's semiconductor silicon wafer market will continue to grow at a higher rate than the global market, reaching about US $4.3 billion by 2026.

Industry competition pattern
1. Regional competition: representative enterprises are mainly distributed in semiconductor industry cluster areas
From the distribution of representative enterprises, the representative enterprises of semiconductor silicon wafer industry are mainly distributed in Beijing, Jiangsu, Shanghai, Zhejiang, Taiwan and other regions forming semiconductor industry clusters, and the upstream electronic polysilicon enterprises are located in Xinjiang.
2. Enterprise competition: the number of enterprises producing semiconductor silicon wafers in batch is relatively small
Since the most commonly used large-size silicon wafer (8-12 inches) products in China mainly rely on imports, the number of enterprises that can mass produce semiconductor silicon wafers is relatively small. At present, the manufacturers with 12 inch semiconductor silicon wafer production capacity in China include Leon micro, Shanghai silicon industry, global wafer, Zhonghuan Co., Ltd., Youyan semiconductor, Shanghai Xinsheng, etc.
——The main market share is occupied by foreign-funded enterprises
Compared with the main semiconductor silicon wafer suppliers, the semiconductor silicon wafer enterprises in Chinese mainland are relatively weak in technology, and have a small market share. The technology level and quality control are still significantly different from those of advanced international level.
Overall, the market share of China's semiconductor silicon wafer industry is mainly occupied by foreign-funded enterprises. It is preliminarily estimated that the domestic semiconductor silicon wafer market scale will reach 12.7 billion yuan in 2020. According to the revenue scale of semiconductor silicon wafer business of domestic semiconductor silicon wafer leading enterprises Shanghai silicon industry, Zhonghuan Co., Ltd., lion micro and Zhongjing technology, the domestic market shares of the above enterprises are 12.1% and 12.1% respectively 10.6%, 7.7% and 1.5%.
Note: the industry competition share of domestic enterprises is calculated by dividing the revenue of enterprises in semiconductor silicon wafer business by the scale of domestic semiconductor silicon wafer market.

Industry development status
1. Overall status of the industry: the market scale of China's semiconductor silicon wafer industry is developing rapidly
According to China China China semiconductor manufacturing industry line's April 2019 production and production line's production and manufacturing technology development, and the rapid development of China's semiconductor terminal products market, the semiconductor silicon market in Chinese mainland has entered a leap development stage, from 2016 to 2018, according to the data of Shanghai silicon industry group Limited by Share Ltd initial public offering prospectus. Chinese mainland semiconductor wafer sales increased from 500 million US dollars to US $992 million, with an average annual compound growth rate of 41%. According to the annual compound growth rate, the sales of semiconductor silicon wafers in Chinese mainland in 2020 were about 2 billion US dollars. In the future, with the continuous production of 8-inch and 12 inch monocrystalline silicon chips in China, the domestic monocrystalline silicon market will usher in rapid development.
2. Application of semiconductor silicon wafer: the application field changes with the product specification
At present, with the upgrading of DRAM, NAND flash memory and other technologies, the demand for 12 inch monocrystalline silicon wafer has increased sharply. Monocrystalline silicon wafers with specifications of 6 inches and below are mainly used in the field of ordinary consumer electronic components. 8-inch monocrystalline silicon wafer is mainly used in the fields of integrated circuits, chips and industrial electronic components.
With the improvement of monocrystalline silicon manufacturing technology, silicon wafer products show a trend of increasing size. According to semi report, in 2020, 12 inch silicon wafer will be the mainstream product in the market, accounting for about 68.4%, 8-inch silicon wafer accounting for about 25.4%, and 6-inch and below silicon wafer accounting for about 6.2%.
——8-inch semiconductor silicon wafer is mainly used in automotive, industrial and smart phone fields
In terms of downstream applications, 8-inch semiconductor silicon wafers are mainly used in sensors, logic chips, discrete components, optocouplers, etc. terminal applications are mainly automobile, industry (including smart factory, smart city and Automation) and smart phones, accounting for 33%, 27% and 19% respectively.
——12 inch semiconductor silicon wafers are mainly used in automotive, industrial and smart phone fields
The demand for 12 inch silicon wafers mainly comes from applications such as memory chips and logic chips. The terminal application fields are mainly smart phones, PCS / tablets, servers and TV / game consoles, accounting for 32%, 20%, 18% and 10% respectively. Server, industrial, automotive and communication applications account for a relatively small proportion, accounting for about 6%, 5%, 5% and 4% respectively.
——Application of 18 inch (450mm) semiconductor silicon wafer: still in the stage of technology R & D breakthrough
Semiconductor equipment suppliers have different views on the process of 18 inch (450mm) silicon wafer and lack enthusiasm for R & D and production. The reason is that 18 inch (450mm) equipment does not simply enlarge the diameter of the cavity, but needs to fundamentally redesign the equipment. Therefore, it is faced with problems such as funds and manpower. So far, the 18 inch (450mm) silicon wafer is still in the stage of technology R & D breakthrough, and has not formed a mass production scale. It is still a problem to be solved for the global semiconductor industry.
3. Installation of downstream Fabs: Chinese mainland wafer fabs are put into operation one after another.
In 2020, Chinese mainland wafer fabs were put into operation. According to the white paper on wafer manufacturing lines in mainland China issued by the core idea Research Institute, as of the fourth quarter of 2020, the total installed capacity of 26 12 inch production lines was about 1.03 million, an increase of 15% over 2019, and the total installed capacity of 24 8-inch production lines was about 1.17 million, an increase of 17% over 2019. The installed capacity of wafer manufacturers of 6 inches and below is about 3.8 million pieces, about 6 inches, an increase of 5% over 2019.
Meanwhile, in 2020, there will be 15 12 inch production lines under construction, under construction or contracted, with a monthly planned capacity of 620000 pieces; There are 7 8-inch production lines under construction, unfinished, under construction or contracted, with a monthly planned capacity of 260000 pieces; At the same time, many 12 inch or 8-inch projects ended without success.

Industry development process: the industry is in the stage of rapid development
Monocrystalline silicon wafer has penetrated into various fields of national economy and national defense science and technology. More than 95% of semiconductor devices and more than 99% of integrated circuits in today's electronic communication semiconductor market need monocrystalline silicon wafer. Throughout the development of monocrystalline silicon wafer, China has experienced preliminary development stage, rapid growth stage, technology breakthrough stage and rapid development stage.
Industry policy background: policy support, industrialization of large-size semiconductor silicon wafer is the key development direction
Since 2010, the Ministry of industry and information technology, the Ministry of science and technology and other departments have successively issued a series of policies on R & D, tax preference and industrialization of semiconductor silicon wafers, including achieving breakthroughs in the field of integrated circuit semiconductor silicon wafers and accelerating the industrialization process of key materials such as 12 inch silicon wafers

1. Definition
Semiconductor silicon wafer, also known as silicon wafer, is an important material for making integrated circuits. Integrated circuits and various semiconductor devices can be made by means of lithography and ion implantation. Silicon wafer is a sheet-like object made of silicon, with a diameter of 6 inches, 8 inches, 12 inches and other specifications. Semiconductor silicon wafer can be divided into 6 inches, 8 inches, 12 inches and 18 inches according to its diameter.
Figure 1: classification of semiconductor silicon wafer (unit: mm, micron, cm2, G, inch)
2. Analysis of industrial chain: Large-size silicon wafer products are highly dependent on imports
China's semiconductor silicon wafer industry chain involves electronic polysilicon manufacturing, semiconductor silicon wafer manufacturing, semiconductor device manufacturing and other links. Among them, the upstream semiconductor silicon wafer raw material electronic grade polysilicon mainly depends on import, and only a few companies can mass produce it.
In the manufacturing of semiconductor silicon wafers, the most commonly used large-size silicon wafers (8-12 inches) in China mainly rely on imports, and only a few enterprises can produce in batch. Manufacturers such as Shanghai silicon industry and Zhonghuan Co., Ltd. have the production capacity of 8-inch silicon wafers and have realized the mass production of 12 inch silicon wafers.